Tag Archives: electrical testing

Circuit boards Electrical testing methods

This time let’s talk about the electrical testing methods of circuit boards, there are: Dedicated,Universal Grid,Flying Probe, non-contact electron beam, conductive cloth (plastic), Capacity and ATG-SCAN MAN), of which there are three most commonly methods:Dedicated,Universal Grid,Flying Probe.To better understand the functions of various equipmenst, the following will compare the characteristics of three major methods.

1. Dedicated test
The reason for the specific type, mainly because they use fixtures only applies to one material number, different number of board material can not be tested and can not be recycled. Test points, the single panel in the 10,240 points, 8,192 points within each two-sided test can be made, the density in the test, because the probe head and the thickness of the relationship between the pitch used for more than the board.
2. Universal Grid test
The basic principle is the Universal test circuit PCB layout is based on the grid (Grid) to design, generally refers to the so-called grid line density,while the Universal test is based on this principle. Therefore making the fixture simple and fast, and explore needle can be reused.Universal test points is usually more than 1 million points.
3,Flying Probe test
Flying Probe test principle is very simple, only needs two probes for x, y, z movement to each of the two end points of each line tested, so no additional production of expensive fixtures. However, as is the end-point test, so very slow speed, about 10 ~ 40 points/sec, more suited for samples and small circuit boards production.

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PCB board electrical testing Introduce

PCB board(printed circuit board) in the production process, will inevitably cause defects on the electrical due to external factors, such as short circuit,open circuit and leakage power, coupled with continued in the high PCB density, thinner pitch and multi-layer evolution, if failed to be screen out defective boards, and allowed to flow into the manufacturing process,the cost will inevitably cause more waste, so in addition to improved process control, improve the testing technology for the PCB manufacturer can also provide reduce scrap and improve product yield solutions .

In the electronics manufacturing process, due to the cost of the damage caused by defects in various stages of varying degree, the easier it will lower the cost of remedy. “The Rule of 10’s” is a commonly used to assess the process at different stages of PCB was found to be defective when the cost to remedy. So PCB board E-testing is the most improtant.

In the PCB manufacturing process, there are three stages to be tested:
1, inner layer etching
2, after etching the outer line
3, finished

Each stage usually 2 to 3 times the 100% testing, screening out bad board for further re-processing. Therefore, the PCB board E-testing is also a question of process data collection point, the best source, by the results, get open circuit, short circuit and other insulation of the percentage for rework inspection, the use of quality control methods to find root of the problem to be solved.